According to project leader Paul Eremenko, Google will be providing the so-called "endoskeleton"of the modular phone, which will initially have eight rear slots for smaller modules, two front slots for a display and buttons panel (for example), and on-board power and data modules based on MIPI UniPro technology - a high-speed interface for interconnecting integrated circuits. The modules will be fixed to the platform with electro-permanent magnets - there are no snaps, harnesses, or hinges.
The endoskeletons will be offered in different sizes, including phablet-size, and smaller ones akin to musical players. These aside, Ara's hardware ecosystem is completely open to interested manufacturers. And, as different kinds of components emerge, users will be able to combine the modules into a fully customized smartphone tailored to their specific purposes - such as photography, medical monitoring, experimenting with sensors, and vice versa.
A working prototype should be finished this month, while the project's research and development process seems to be going full steam.
