Editor in Chief
- Dec 30, 2010
- Reaction score
- Austin, TX
Uh oh... The infamous heat problem with Qualcomm chips might have returned. Throughout the last year, one of the big topics of conversation has been the overheating issues faced by Qualcomm with their Snapdragon 810 chipset. The problem was so egregious that Samsung declined to use the chip in their Galaxy S6 line. For a while, the industry speculated that Sammy was just taking an opportunity to try and hurt Qualcomm's reputation so they could push their own Exynos chips.
Even when it was revealed that Qualcomm really did have heat issues with the chipset, various media outlets continued to speculate that Samsung was taking advantage of the situation to pump up their own brand name in SoC manufacturing. While that may or may not be true, the latest murmurings from the supply side world suggest that overheating problems have once again reared their ugly head for Qualcomm, but this time it is with the Snapdragon 820.
What's really interesting is that this time, instead of abandoning Qualcomm and taking advantage of the situation, Samsung is supposedly digging in deeper to help Qualcomm work out the issues. This is partly because Qualcomm is using Samsung for their 14nm FinFET manufacturing process design on the chipset, because TSMC is still stuck at 20nm. We've also heard previous rumors that Samsung has committed to using both Qualcomm and their own Exynos chips in the new Galaxy S7. This is obviously another incentive to help Qualcomm make the chipset work.
For now, take this intel with a heaping helping of salt. We haven't been able to get any additional corroboration on this piece so it's possible it is bogus. We will keep an ear to the ground and let you know.