It looks like mobile tech is starting to evolve in a similar fashion as the Desktop PC industry. Over the years, desktop computers kept introducing hotter and hotter CPUs requiring more exotic cooling solutions, and we may be seeing the same thing happening with smartphones.
The image above is supposedly a leaked photo of the chassis for the 2016 version of the Moto X. The most notable characteristic of this case design is that includes a heatpipe internally. For those unfamiliar with a heatpipe, it is similar to the heatsinks that you find on CPUs of powerful desktop PCs. (Technically a heatpipe is usually just one component of a heatsink/fan combo.) The purpose of the heatpipe is to draw heat away from the chipset or power source.
If Motorola plans to use this design in their next flagship device, it suggests the chipset for the smartphone will produce quite a bit of heat. Either that, or Motorola has simply found a crafty way of dissipating heat in a more specific manner.
There's one other thing of note in this pic. The speaker grille location in this image does line up with an earlier supposedly leaked image of the Moto X 2016. In that report, we suspect the case design is a fake. That means that either this one is a fake too, or both of them are legit, or it's merely a coincidence that the speaker holes lineup. We will keep an eye out for any further details.
Here's a link to our Motorola forum for further info and discussion: Motorola Forum | Android Forum at DroidForums.net
Source: gforgames
