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Oppo R5 Used to Slice Through an Apple and More in Surprising Video

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dgstorm

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Above is a really strange and intriguing commercial for the Oppo R5. This device is one of the thinnest smartphones in the world, which obviously brings up doubts about its ruggedness. Apparently Oppo wanted to dispel those fears and this video goes a long way toward that.

The video leads off with the phone being used as a tool to slice through an Apple (nice innuendo) and then a watermelon. They also use it as a nutcracker, a hammer and run over it with a car. The phone comes out unscathed each time, and the most shocking part is that it is completely unscratched after hammering a nail into a two-by-four.

Here at HQ we are a bit skeptical of this video, but find it entertaining none-the-less. If this isn't rigged, it makes us wonder what they made the Oppo R5 out of... titanium?

What do you think?
 
I feel like something is fishy here, but I don't care.

I know I've made my point about how this phone is ridiculously thin, and not in a good way, but this was cool and kinda almost, but not quite really, makes me want to look into it more.

And I'm not really surprised that it didn't smoosh under the car tire there. There's gotta be absolutely no room for any kinda movement of components inside this tiny little body.
 
Ok so it'll survive being thrown from an airplane at 10k', a nuclear explosion and a preteens temper tantrum BUT will it survive in a pocket without bending permanently?

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im impressed, but im no engineer, does anyone know if there is no room for movement inside the tech, does that mean heat will wreak havoc on the insides, shortening battery life, processor speeds, RAM wutchamuhcallits?
 
Heero121 said:
im impressed, but im no engineer, does anyone know if there is no room for movement inside the tech, does that mean heat will wreak havoc on the insides, shortening battery life, processor speeds, RAM wutchamuhcallits?
Click to expand...
Probably not with proper shielding, heat syncs, etc.

You don't need room for air for heat to make it's way out, just proper channeling of the heat to the outside for the most part. They don't leave THAT much room in any device really.
 
Heero121 said:
im impressed, but im no engineer, does anyone know if there is no room for movement inside the tech, does that mean heat will wreak havoc on the insides, shortening battery life, processor speeds, RAM wutchamuhcallits?
Click to expand...


Jonny Kansas said:
Probably not with proper shielding, heat syncs, etc.

You don't need room for air for heat to make it's way out, just proper channeling of the heat to the outside for the most part. They don't leave THAT much room in any device really.
Click to expand...

Agreed... Point of contact heat stinks (copper or aluminum plates) and thermal transfer pipes (copper tubes), leading to outward mounted exterior heat transfer plates (copper or aluminum) , can accomplish far more than fans and/or air channels. The actual aluminum exterior case can function as the external dissipation plates. About the only way to move heat better than copper (or to a lesser extent aluminum) is liquids (water or better still propylene glycol), but I doubt you'd ever see pumped water or glycol lines in a phone.
 
FoxKat said:
Agreed... Point of contact heat stinks (copper or aluminum plates) and thermal transfer pipes (copper tubes), leading to outward mounted exterior heat transfer plates (copper or aluminum) , can accomplish far more than fans and/or air channels. The actual aluminum exterior case can function as the external dissipation plates. About the only way to move heat better than copper (or to a lesser extent aluminum) is liquids (water or better still propylene glycol), but I doubt you'd ever see pumped water or glycol lines in a phone.
Click to expand...

Thank you, professor, for delving further into it than I had any desire to! Haha
 
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