Hey, new guy here. I just wanted to share my weekend project of adding a functional copper heatsink to my original Motorola Droid. It was a fairly simple mod that only took an hour or so but has helped to reduce operating and return to idle temperature during heavy use. The goal is to keep the temps in check in order to extend processor life and maybe push the overclock a bit higher.
Currently I'm running CCR Sapphire 1.1.1 with the 1.2ghz standard voltage kernel and before the mod my Droid would get quite warm under load. With the heat sink you can feel the copper plate heat up much quicker than the plastic backing would before but the heat is more quickly dissipated. I've confirmed this with a SetCPU stress test - the processor temp will rise to 48C or so but return back to 30C after 2 or 3 seconds. It's seriously overkill for a processor that doesn't even require a heat sink to begin with but that's what hacking is all about.
Disclaimer: this mod is very dangerous, and there is a very real chance you will end up bricking your Droid if you slip up even once during the teardown or removal of the OMAP RF shield. The SMD passives are very tiny and even bumping them will probably cause irreparable damage to your phone. Do not attempt this if you are not OK with the very real chance that you will be parting with lots of money for a new phone. Of course your warranty will be voided (if it hasn't been already)
Droid teardown instructions from phonewreck (phoneWreck Motorola Droid Teardown Images!) were used for disassembly and locating the processor.
The first step is to remove the case and remove the plastic above the processor
Next up is to remove the RF shield. The preferred way is to desolder it but I wasn't comfortable working around all those passives, so I chose to snip off the top using the 3 holes in the corner of the shield as starting points. This is where you will brick your phone (I got lucky)
Install the back cover and your droid should now have an exposed brain
Testing... this was a pucker moment. It works!
The heat sink was cut from .016" copper sheet with a dremel and attached to the CPU with sticky thermal tape and a small square of rubbery thermal transfer pad. The pad is necessary because the CPU is recessed into the case quite a bit. This could be solved with a small metal riser soldered to the main plate but the pad still gives you a degree of mechanical separation to keep pressure on the back of the phone from damaging the processor, main board, and its connections.
The part that goes over the camera was cut to size and stuck back on. There's a big scratch where the razor slipped when I was doing this step, but luckily it didn't go anywhere near the lens. Scissors work just as well on the thin plastic so I recommend going that route.
The finished product. The back will get less shiny with wear (which is what I want). My friend said it looked like one of those stick-on signal strength boosters